The Model 308 UV Light Meter is used in Photolithography, MEMS, 3D Printing, Packaging, and UV Curing & Sterilization. Accuracy of this UV Light Meter is within ±3% and measurement repeatability is within ±3 LSB (least significant bit). Like all OAI precision instruments, the Model 308 provides NIST traceable measurements. This easy-to-use light meter is auto-ranging from 0.1 to 1999.9mW/cm² full scale when used with the 2000mW/cm² probe. The linearity of the UV Light Meter in this range is at least ±.002%-6 LSB.

Power for the Model 308 Light Meter is supplied by a 9V alkaline battery and the easy-to-read LCD display consumes very little power for extended battery life. This easy to use, handheld UV Light Meter features a peak hold switch enabling the user to capture the maximum intensity reached during an exposure while retaining the reading on the display. OAI maintains a Calibration Laboratory to ensure that all products continue to meet specifications.

The Model 308 UV Light Meter is available with a family of calibrated detachable probes having spectral responses peaked in the UVA range at 365nm, 380nm, 400nm, 420nm, 436nm, and 540nm, the UVB range at 310nm and UVC range at 220nm, 253.7nm, and 260nm. Each detachable probe employs an ultra-stable silicon detector and special filters that precisely shape the spectral response. For added ease-of-use, probes are calibrated for direct reading without any additional adjustment. In cases where the measurements are to be performed in environments having significant infrared (IR) radiation levels, OAI can supply an optional high-intensity, high-temperature, detachable probe.

APPLICATIONS

Perfect for a wide variety of industries where the precision measurement of UV light is essential, the Model 308 is designed for any application requiring repeatable, reliable UV measurement.

• Lithography
• UV Curing
• 3D Printing
• Microfluidics
• MEMS
• Sterilization
• Medical

SPECIFICATIONS

Model 308 UV Light Meter

• Relative Accuracy:
  • 275-2000mW/cm² range: ±(.042% of reading +.450mW/cm²)*
  • 0-275mW/cm² range ±(.089% of reading +.0545mW/cm²)*
• Linearity:
  • 0-275mW/cm² range ±(.002% of reading +.0297mW/cm²)
  • 275 – 2000mW/cm² range ±.300mW/cm²
• Display Range: 0.1-1,999
• Power: 9V battery (1)
• Dimensions: 4.4″ width x 7.7″ height x 1.25″ depth
• Weight: ≈10oz
• Meter & Probe Accuracy: ±3%
• *NIST traceable

Model 308 UV Light Meter with detachable 2w/cm² probes

• Relative Accuracy: ±2.5% of OAI standards*
• Sensor Material: Silicon (UV enhanced)
• Filter: Multi-layer or dielectric filter absorption glass
• Dimensions: 1.75″ diameter x 0.63″ thick
• Weight: ≈3oz
• Cable Length: 4ft
• For probes over 2mW/cm²: Contact OAI for more information
• *NIST traceable

FEATURES

• RoHS and CE compliant
• Detachable single or dual wavelength probes
• Auto ranging, digital display
• Light intensity measured in mW/cm²
• NIST traceable
• High speed serial port for data logging

OPTIONS

• Data logging software for mode, time, wave length, serial numbers and calibration due date available.
• Data for analysis can be downloaded to an Excel file.

Power for the Model 308T UV Light Meter is supplied by a 9V alkaline battery and the easy-to-read LCD display consumes very little power for extended battery life. The Model 308T is very easy to use and features a peak hold switch enabling the user to capture the maximum intensity reached during an exposure and retain the reading on the display. OAI maintains a certified Calibration Laboratory to ensure that all products continue to meet specifications.

Detachable probes matched to specific UV curing spectral regions. The OAI Model 308T Meter is available with a family of calibrated detachable probes having spectral responses peaked in the UVA range at 365nm, 380nm, 400nm, 420nm, 436nm, and 540nm, the UVB range at 310nm and UVC range at 220nm, 253.7nm, and 260nm. Each detachable probe employs an ultra-stable silicon detector and special filters that precisely shape the spectral response. For added ease-of-use, probes are calibrated for direct reading without any additional adjustment. In cases where the measurements are to be performed in environments having significant infrared (IR) radiation levels, OAI can supply an optional high-intensity, detachable probe. These probes use special heat-resistant optics and silicon probe housing.

APPLICATION

Perfect for high intensity UV Curing Exposure Systems

SPECIFICATIONS

Model 308T UV Light Meter

• Relative Accuracy:
  • 275-2000mW/cm² range ±(.042% of reading +.450mW/cm²)*
  • 0-275mW/cm² range ±(.089% of reading +.0545mW/cm²)*
• Linearity
  • 0-275mW/cm² range ±(.002% of reading +.0297mW/cm²)
  • 275 – 2000mW/cm² range ±.300mW/cm²
• Display Range: 0.1-1,999
• Power: 9V battery (1)
• Dimensions 4.4″ width x 7.7″ height x 1.25″ depth
• Weight: ≈10oz
• Meter & Probe Accuracy: ±3%
• *NIST traceable

Model 308T UV Light Meter with detachable 2mW/cm² probes

• Relative Accuracy: ±2.5% of OAI standards*
• Sensor Material: Silicon (UV enhanced)
• Filter: Multi-layer or dielectric filter absorption glass
• Dimensions: 1.75″ diameter x 0.63″ thick
• Weight: ≈3oz
• Cable Length: 4ft
• For probes over 2mW/cm²: Contact OAI for more information
• *NIST traceable

FEATURES

• RoHS and CE compliant
• Detachable single or dual wavelength probes
• Auto ranging, digital display
• Light intensity measured in mW/cm²
• High speed serial port for data logging
• NIST traceable

The Large Substrate Exposure System is designed for markets requiring exposure of large glass panels. Using OAI’s advanced beam optics, the system utilizes a UV light source with beam size from 12in² to 20in² using while applying 1kW to 8kW lamp powers. This provides a uniform beam of ±10%. The system enables a printing resolution of ≤2.0μ. The system can handle a wide variety of substrate thickness from thin to thick and bonded panels. OAI’s Large Substrate Exposure System is the total package for performance, dependability, and repeatability for exposure of large area glass panels.

The Model 30E Enhanced UV Light Source is highly efficient and may be utilized in a variety of applications. Light is collected by an ellipsoidal reflector and focused on an integrating/condensing lens array to produce uniform illumination at the exposure plane. This UV light source is available in various beam sizes up to 24in² with output spectra ranging from 220nm to 450nm, using the appropriate lamp (included). Output power ranges from 200W to 5kW. All OAI UV light sources are easily equipped with quick-change filter assemblies, enabling the user to customize the output spectrum with little effort. Optional remote exhaust fans are available.

Dual channel intensity controllers control light source intensity to a user-desired level and keep it constant over the lifetime of the lamp. Controllers feature dual-channel optical feedback, allowing adjustment from one intensity level or spectral sensitivity to another. Intensity controllers feature a visual display for monitoring lamp intensity and power. Range scales automatically for different intensity levels. Audible alarms alert operator when a lamp change is required.

The shutter timer (used with freestanding exposure systems) activates the light source shutter. The timer range is from 0.1 to .999 seconds. An interface for controlling other shutter speeds is available.

The OAI UV LED Light source delivers a beam size of between 4″ and 12″ with beam uniformity better than ±4%. It features a prism array and light pipe for superior uniformity. Collimation angle less than 2 degrees. This light source is capable of variable intensities, with wavelength of 365nm, 405nm, or a combination thereof. Additional features include dose control and timed exposure. Easy to use, the OAI light source uses a touch screen interface and has a USB remote interface.

The UV light source offers a variety of options including a heavy-duty stand, a Tooling Module for photolithography printing, and single or multiple wavelength versions. This system may be integrated into any OAI Lithography System.

Both versions of the Model 2000 Exposure System include a UV light source, intensity controlling power supply, and robotic substrate handling subsystem. UV light sources provide adjustable intensity beams with divergence half-angles of <2.0%. Power supplies are available from 200W to 2,000W. Intensity controller sensors are linked directly to the light source for accurate intensity monitoring. The robotic substrate handling system is microprocessor controlled and may be programmed to accommodate a wide variety of substrate sizes. The shadow mask capability enables the user to pattern the top of a substrate while being held in very close proximity to the mask. At a separation of 25μ, these systems are capable of 6μ resolution.

In the SM configuration, the Edge-bead Exposure System provides a cost-effective method for edge-bead removal using standard shadow mask technology. Mask and substrate changeover can be accomplished quickly and easily, adding to both versatility and throughput of this high-volume production tool.

In the AF configuration, the Model 2000 Flood Exposure System is used to augment, and/or enhance the photolithography processes in both production and R&D environments. Applications include photo resist stabilization and modification, image reversal, and PCM processes.

The Model 2012SM Automated Edge-Bead Exposure System provides a cost-effective method for edge-bead removal using standard shadow mask technology.

Both models allow for rapid and efficient mask and substrate changeover, adding to both versatility and high-volume throughput of this production tool. Additionally, they are designed to accommodate wafers from 8″ to 300mm and the tool features automated FOUP loading.

The alignment module features mask insert sets and quick-change wafer chucks that facilitate the use of a variety of substrates and masks without requiring special tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and Z axes.

The Model 200 Mask Aligner features a dependable OAI UV Light Source which provides collimated UV light in Near or Deep UV using lamps ranging in power from 200W to 2000W. Dual-sensor, optical feedback loops are linked to the constant intensity controller to provide control of exposure intensity within ±2% of the desired intensity. This mask aligner is a flexible, economic solution for any entry-level mask alignment and UV exposure application and is also available with a LED Light Source.

This mask aligner features a dependable OAI light source that provides collimated UV light in Near or Deep UV using lamps ranging in power from 200W to 2000W. Dual-sensor, optical feedback loops are linked to the constant intensity controller to provide control of exposure intensity within ±2% of the desired intensity. Changes may be made to the UV wavelength quickly and easily. The Model 200IR Mask Aligner is a flexible, economic solution for any entry-level mask alignment and UV exposure application for MEMS, Microfluidics, and NIL.

STEP1 – Plasma or UV Treatment

STEP2 – Vapor Phase Mold Release Treatment

The Model 100MT release treatment process is designed to add an antistiction monolayer coating on the mask surface to prevent adhesion of the photoresist to the mask. Using a programmable automatic process control with a time saving setup, a contact angle of up to 110 degrees can be achieved.

BENEFITS:

+ Can process up to 20 masks in a batch process.

+ Extends mask cleaning from 5-10 wafer exposures to200 wafer exposures

+ Eliminates mask wet cleaning process

+ Lowers Cost of Ownership (COO)of your mask aligner

OAI’S Model 200E DUV Mask Aligner performs all the functions of the tabletop Model 200 Mask Aligner but utilizes a 185nm Excimer Lamp as the UV light source. It is used for biotechnology processing.

In response to industry demands for a low-cost R&D mask aligner for larger substrates (up to 12″x12″ or 300mm diameter), OAI has developed the Model 212 Tabletop Mask Aligner. The mask aligner is based on OAI’s proven modular approach, leveraging OAI’s extensive experience with the Model 200 Tabletop Mask Aligner. The exemplary OAI Model 200 Mask Aligner is an entry-level tool that is installed in R&D labs worldwide.

The Model 212 Mask Aligner is engineered to accommodate 12″x12″ or 300mm substrates as well as smaller size mask inserts and substrate holders, thus adding to the versatility of the tool. The Model 212 is especially useful for research and development labs and has quickly gained acceptance in labs worldwide. With our modular design approach, OAI offers the highest quality precision mask aligners at the lowest total cost of ownership. The Model 212 Mask Aligner fills the void for those researchers who require a versatile, cost effective 300mm mask aligner system for R&D.

Built on OAI’s proven modular platform, the Model 800E is an enhanced, high-performance, high-resolution lithography system which delivers a level of performance that is offered at an extremely compelling price point. The aligner system features OAI’s Advanced Beam Optics which deliver exceptional uniformity. Upgradable using OAI’s Precision Lithography Modules, the Model 800E is a highly versatile tool in the lab or in low-volume production. The Model 800E utilizes a Windows 7 PC control platform with extensive recipe storage capacity. The system also comes with joystick-controlled alignment and optics stages and can be configured with non-contact, 3-point wedge effect correction, and auto-align capability. These combined features are typically found in automated production mask aligner systems but are now available on the Model 800E at a more affordable price.

The Model 800E is unique owing to the inclusion of advanced features which are found in the OAI Model 6000 production mask aligner tool. By utilizing the proven OAI modular mask aligner platform, we are able to adopt technology from our more advanced tools to produce a powerful system at a more affordable price.

The Model 6000A-MC is a precision system combining OAI’s Model 6000, Automated Production Mask Aligner, with an integrated mask changer. The mask changer can handle from 10 to 150 masks. Ideal for both semiconductor and bio-tech applications. It also is designed with a bar code reader to assure each mask is coordinated to the right process. Please contact OAI for further product information.

■ UV Ozone Treatment Systems available for R&D through production

■ Super low-pressure lamps for improved surface treatment

■ Improves bonding for polymer and glass

■ Improves yield