The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing/vacuum chuck leveling system, the substrate is leveled quickly and gently for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and Z axes.
This mask aligner features a dependable OAI light source that provides collimated UV light in Near or Deep UV using lamps ranging in power from 200W to 2000W. Dual-sensor, optical feedback loops are linked to the constant intensity controller to provide control of exposure intensity within ±2% of the desired intensity. Changes may be made to the UV wavelength quickly and easily. The Model 200IR Mask Aligner is a flexible, economic solution for any entry-level mask alignment and UV exposure application for MEMS, Microfluidics, and NIL.
