Model C&D P9000 / OAI 6000: Integrated Lithography Cell

Coat | Bake | Align/Expose | Develop

  • Fully manufactured in the USA
  • Cluster configuration allows for dynamic wafer flow and parallel application processing
  • Single terminal for control over recipe and program selection; P9000 performs as the master user interface
  • Fewer operators needed in the lithography module.
  • Reduced wafer handling: higher wafer yield, reduced contamination and defects, higher die yields
  • Lower cost of ownership for maximum return on investment versus other integrated system suppliers
  • Small footprint for reduced fab space usage
  • Multiple wafer sizes can be processed simultaneously
  • Optimized for customer requirements